Hybrid integrated circuit - Wikipedia
In military and space applications, numerous integrated circuits, transistors and diodes, in their die form, would be placed on either a ceramic or beryllium substrate. Either gold or aluminum wire would be bonded from the pads of the IC, transistor, or diode to the substrate.
HIGH TEMPERATURE (250 °C) SIC POWER MODULE FOR MILITARY HYBRID ELECTRICAL VEHICLE APPLICATIONS. R. M. Schupbach, B. McPherson, T. McNutt, . A. B. Lostetter John P. Kajs, and Scott G Castagno. UNCLASSIFIED: Distribution Statement A. Approved for public release. Standard Form 298 (Rev. 8-98) Prescribed by ANSI Std Z39-18. Why High Temperature?
HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to PRF38534@dla.mil. Since contact information can
In this paper, a new line of high performance SiC power modules, HT-2000, is presented. The HT-2000 series of modules are rated to 1200V, are operational to greater than 100A, can perform at temperatures in excess of 250 °C, and can be constructed with SiC MOSFETs, JFETs, or BJTs.
Military/Aerospace & High Reliability - Johanson Technology, Inc.
Military/Aerospace & High Reliability. Johanson Dielectrics and Johanson Technology have over 50 years of experience specializing in the design and manufacture of high-quality ceramic products. Johanson provides Mil Standard Qualifications, Mil-Standard screening, and COTS for Ceramic Chip Capacitors, RF Passives, and RF Inductors to high ...
Hybrid and module technology for high-reliability applications
Apr 25, 2012 · Military-grade hybrids frequently use ceramic multichip module packaging, and power modules continue to utilize metal can packages. High power regulator modules in particular, traditionally come with a bolt-down or brick type configurations and are intended for rack level or LRU supplies.
Plastic encapsulated microcircuits (PEM) are molded, potted, or coated semiconductor die or hybrid integrated circuits in which the encapsulant or coating is in direct contact with the die, leadframe and/or signal traces, interconnects, and barrier layers of the device.
The main goal of using hybrid circuits (apart from PTF), is saving space, volume and weight compared to ordinary printed circuit boards. However, we can also achieve superior high frequency properties and very high reliability. This makes hybrid circuits suitable for demanding military systems, space applications,
Thick Film and Ceramic Technologies for Hybrid Multichip Modules …
Sep 27, 2017 · They are thick film multilayer (TFM), high temperature cofired ceramic (HTCC), and low temperature cofired ceramic (LTCC) MCM-C technologies. In fact, standard TFM hybrid circuits may be the oldest type of MCM-C. Download to read the full chapter text.
A GaAs MMIC LNA for Military and Commercial ... - Microwave …
Jun 1, 2006 · The HMC566 LNA is ideal for hybrid and multi-chip module (MCM) assembly applications due to its compact size, convenient layout and flexible mounting options. It is fabricated in a mature GaAs pHEMT process.
- Some results have been removed