Analog Devices’ newest powerful and full-featured battery charging and PowerPath manager ICs, the LTC4162 and LTC4015, simplify a very difficult high voltage and high current charging system. This ...

3D integration is a rapidly growing topic in the semiconductor industry that encompasses different types of technologies. The paper addresses one of the most promising technologies which uses through ...

A packaging study of an acceleration microelectromechanical systems (MEMS) sensor is presented. The sensor consists of two silicon chips: a surface micromachined capacitive transducer (g-cell), which ...

Arteris’ expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and ...

Arteris’ expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and ...

With AI being the biggest change in IT infrastructure since the Dot Com boom, it was no surprise that at the annual Cisco ...

SLM is a key element of Siemens’ strategy to use a digital twin to address complex challenges and drive innovation effectively. A digital twin of a product is a virtual representation of the actual ...

Advanced semiconductor capabilities are vital for the development of future AI solutions and Arteris’ innovative technology plays a pivotal role. Arteris’ offering reduces chiplet and SoC design time, ...

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...