In order to address the Chip-Package Interaction (CPI) risks associated with advanced silicon packaging, GLOBALFOUNDRIES has developed Finite Element (FE) models to simulate the mechanical stress in ...

Since the onset of the US-China tech war, both sides have engaged in multifaceted struggles over strategic industries such as semiconductors, AI, and critical resources.

Amazon (NASDAQ: AMZN), via AWS, is developing a high-performance AI chip that could rival Nvidia’s (NASDAQ: NVDA) top-tier offerings, signaling a potential turning point in the market’s ...

The chip uses a combination of tuneable lasers (created by using an optical amplifier with on-chip filter circuits), electro-optic modulators and photodetectors, low-loss waveguides and passive ...