Semiconductor Engineering1d
FOPLP Gains Traction in Advanced Semiconductor Packaging
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...
IEEE20d
Optimization of the Power/Ground Ball Map in 3D-IC BGA Packages with Multiple Power Domains using Deep Reinforcement Learning
Abstract: In this paper, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3D-ICs considering ...
Engineering360 News28d
DC-DC Converter Chips Information
TO-263 is the surface-mount version of the TO-220 package. Other IC packages for DC-DC converter chips include shrink small outline package (SSOP), small outline integrated circuit (SOIC), small ...
Semiconductor Engineering29d
Revolutionizing IC Packaging With High-Density RDL Technology
The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology ... and sidewall etch issues ...
Engineering360 News29d
Codec ICs Information
Codec IC chips are used to encode and decode or compress and decompress various types of data, particularly when bulk storage is required. Codec is an abbreviation for coder-decoder or ...