When TSMC started making semiconductor chips, India too had a fab. The difference was India's first fab did not scale and grow. whereas TSMC reached the peaks of foundry technology. India's progress ...

Nexperia introduced a new series of high-performance gate driver ICs designed for driving both high-side and low-side N-channel MOSFETs in a synchronous buck or half-bridge configuration. These ...

Samsung starts mass production of its 1Tb QLC V-NAND Date: 20/09/2024 Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND).

Toshiba launches helium-sealed 24TB and 28TB HDDs Date: 20/09/2024 Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides ...

Canalys reported that the global wearable band shipments grew 0.2% in Q2 2024 to 44.3 million devices. Basic watches continued to drive the market, with shipments up 6% year on year, largely thanks to ...

Victor Xu, Satellite Communications Industry Analyst at ABI Research, identifies key market opportunities for satellite IoT in the Agriculture, Energy & Utilities, Fisheries and Aquaculture, and ...

Littelfuse released the new SMBLCE-HR/HRA, SMCLCE-HR/HRA, and SMDLCE-HR/HRA High-Reliability Low Capacitance TVS Diode Series. This groundbreaking series of TVS diodes is designed to safeguard ...

ABI Research said the chipset revenues from AI-dedicated silicon for IoT-focused applications reaching over US$7.3 billion by 2030. The trend driving this growth is due to embedded chipset vendors ...

Date: 29/07/2024 onsemi signed a multi-year deal with Volkswagen Group to be the primary supplier of a complete power box solution as part of its next-generation traction inverter for its Scalable ...

“The IX4352NE extends our broad range of low-side gate drivers with a new 9 A sink/source driver, simplifying the gate drive circuitry needed for SiC MOSFETs," commented June Zhang, Product Manager, ...

QuickLogic announced its selection by a large multi-national company for eFPGA IP targeting the TSMC N12e, 12nm process. IP delivery for this contract is scheduled for fiscal year 2024. This design is ...