The 3D printing market is expected to grow from USD 16.16 billion in 2025 and is estimated to reach USD 35.79 billion by 2030 ...

This study selected nanosilver metal particle fillers with a modified layer residual rate of <0.4 wt%. Research has found that the glycidyl ester resin structure can produce coordination relationships ...

Recently, Ag and Cu sinter paste joining is a proven bonding technology for SiC power modules application with a good thermal conductivity and which can be performed in low-temperature low-pressure.