SLM is a key element of Siemens’ strategy to use a digital twin to address complex challenges and drive innovation effectively. A digital twin of a product is a virtual representation of the actual ...

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

Reconfigurable architectures may help reduce the risk of stranded assets in the fast-moving AI space. Despite its potential, ...

Intel is undergoing a major transformation, shifting from a CPU-centric model to a multi-platform foundry and AI silicon ...

3D integration is a rapidly growing topic in the semiconductor industry that encompasses different types of technologies. The paper addresses one of the most promising technologies which uses through ...

These are laser-cut from a GaN wafer, which has copper interconnects already attached, making it much easier to then attach the dielet to a traditional silicon die.

Arteris’ expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and ...

Arteris’ expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and ...