Analog Devices’ newest powerful and full-featured battery charging and PowerPath manager ICs, the LTC4162 and LTC4015, simplify a very difficult high voltage and high current charging system. This ...

3D integration is a rapidly growing topic in the semiconductor industry that encompasses different types of technologies. The paper addresses one of the most promising technologies which uses through ...

A packaging study of an acceleration microelectromechanical systems (MEMS) sensor is presented. The sensor consists of two silicon chips: a surface micromachined capacitive transducer (g-cell), which ...

Arteris’ expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and ...

Arteris’ expanded multi-die solution addresses this shift with a suite of enhanced technologies that are purpose-built for scalable and faster time-to-silicon, high-performance computing, and ...

Advanced semiconductor capabilities are vital for the development of future AI solutions and Arteris’ innovative technology plays a pivotal role. Arteris’ offering reduces chiplet and SoC design time, ...

Systematic monitor analytics approach evaluates power and performance of silicon from a small volume of test chips to the ...

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, ...