Dialing in nanosecond pulses to cleanly cut silicon wafers. Focused on edge quality, thermal effects, and process repeatability.

Heterogeneous integration is a key enabler of today’s AI innovations. By bringing together multiple chips with different functionalities, a.k.a., chiplets, AI devices have been able to achieve ...

In this research, the 6-Degree of Freedom (6-DOF) industrial robot arm is designed to be able to run or perform flexible industrial functions and tasks. To perform these functions in a flexible ...

We consider multi-static imaging systems composed of frequency-diverse transmitting antenna arrays (or apertures). In these frequency diverse imaging modalities, accurate near-field characterization ...

The goal of SUPREME is to develop stable fabrication processes for superconducting quantum chips and provide European academia, SMEs and large enterprises with access to these fabrication processes.