With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC?

A 555 ADC with continuous integration without precision capacitors and symmetrical bipolar conversions from a single unipolar ...

The article illustrates techniques for generating parallel logic outputs with industrial serialized digital inputs.

In a hard-to-articulate way, it’s somewhat comforting to know that even in our world of highly integrated, multifunction ...

The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million gates needs a way to get all that data in and out! Early on, packages just ...

LogicFlo raises $2.7M to bring agentic AI to change work for pharmacology and medtech teams - SiliconANGLESiliconANGLE Media is a recognized leader in digital media innovation serving innovative ...

Prebond testing of through-silicon-vias (TSVs) and die logic is a significant challenge and a potential roadblock for 3-D integration. Built-in self-test solutions introduce considerable die area ...

A redundant multivalued logic is proposed for high-speed communication ICs. In this logic, serial binary data are received and converted into parallel redundant multivalued data. Then they are ...