The demand for high-performance devices, particularly in AI, HPC, and data centers, has surged dramatically in the ever-evolving landscape of integrated circuit technology ... and sidewall etch issues ...

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...

IC switching voltage regulators are available in a variety of IC package types. Dual in-line packages (DIP) can be made of ceramic (CIP) or plastic (PDIP). Quad flat packages (QFPs) contain a large ...

Abstract: Systems, eye-mountable devices, and methods that facilitate chronotherapeutic treatment of primary open-angle ...

Abstract: Plasma-based dry etching techniques play a major role in the formation of silicon-based integrated circuits. The first part of this paper reviews our understanding of the means for achieving ...

It’s the 100th anniversary of women gaining the right to vote, and the birthday of the adoption of the 19th Amendment provides area museums an opportunity to explore the profound impact of the women’s ...

TO-263 is the surface-mount version of the TO-220 package. Other IC packages for DC-DC converter chips include shrink small outline package (SSOP), small outline integrated circuit (SOIC), small ...

Abstract: In this paper, a deep reinforcement learning (DRL) approach that optimizes the power/ground ball map design within the ball grid array (BGA) package of 3D-ICs considering ...