KYOCERA AVX introduces 9159-800 Series, pioneering compact, dual-entry card-edge connectors for various industrial ...

As leading SiC supplier, ROHM has been working to develop high-performance SiC SBDs that offer breakdown voltages suitable for high-voltage applications with ease of mounting. Adopting an optimized ...

ROHM Semiconductor today announced new automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading[1] low loss characteristics with high short-circuit resistance. This ...

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance ...

Ardagh Metal Packaging S.A. (AMBP) is looking like an interesting pick from a technical perspective, as the company reached a key level of support. Recently, AMBP's 50-day simple moving average ...

In the global packaging industry, the quest for robust marketing and sales intelligence is ongoing and ever-evolving. An increasing number of companies are now on a continuous search for leading sales ...

In the dynamic world of the packaging industry, where consumer demands and market trends are ever-evolving, the need for robust sales intelligence solutions is paramount. Companies are on a constant ...

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system performance across various applications such as AI and high-performance ...

Costco recalled nearly 80,000 pounds of store-brand butter last month because the product's label was missing a key ingredient: milk. The wholesaler recalled 79,200 pounds of two varieties of ...

To help find and source new investments, the private investment firm adds the CEO Anixter had at the time it merged with Wesco.