Infineon Technologies is intensifying its collaboration with suppliers to further reduce CO 2 emissions along the whole ...

The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and ...

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the ...

UC Santa Barbara researchers have achieved the first-ever “movie” of electric charges traveling across the interface of two ...

Heidelberg Instruments has launched its new NanoFrazor nanolithography system, advancing decades of expertise in micro- and ...

Nova says that one of the world's leading logic manufacturers recently qualified Nova Prism 2 to address backside power ...

The electronic design automation (EDA) industry reported substantial revenue growth in Q2 2024,” said Walden C. Rhines, ...

The partnership with IPro Silicon IP Ltd. will allow Baya Systems to scale its groundbreaking technology across new global markets. IPro, a leading supplier of custom processors, security solutions, ...

Mitsubishi Electric's Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips made ...

Expanded network-on-chip tiling supported by mesh topology capabilities in FlexNoC and Ncore interconnect IP products allow systems-on-chip with AI to easily scale by more than 10 times without ...

With a shared vision for transparency and open-source innovation, SensiML and Efabless are addressing two of the most complex challenges in IoT development: Sourcing silicon optimized to suit the ...

Hosted by SEMI Southeast Asia and the Asia Clean Energy Coalition (ACEC), the roundtable, titled ‘Accelerating Clean Energy ...