IC package converters and adapters are electronic interconnect devices that are used to interface different types of integrated circuit (IC) sockets. Types of IC Package Converters and Adapters ...
Bonding Die bonding is the attachment of IC chips or dies using an adhesive into a package. Back Grinding Thinning of dies or chips using back grinding processes to improve thermal dissipation and ...
Several vendors are ramping up new inspection equipment based on infrared, optical, and X-ray technologies in an effort to reduce defects in current and future IC packages. While all of these ...
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