High-Bandwidth Memory 5 is intended to further increase the number of memory layers. This requires modern stacking technology ...

Intel’s current mobile processor, Lunar Lake, will be a “one off” design that incorporates memory inside the package, Intel chief executive Pat Gelsinger said during a conference call on Thursday ...

An industry first, the new DRAM brings huge improvements to both capacity and performance. With these new memory modules, we might finally stop seeing GPUs with just 8GB VRAM in the near future ...

Rambus unveils memory interface chipsets for Gen5 DDR5 RDIMMs and next-gen DDR5 Multiplexed Rank Dual Inline Memory Modules ...

The memory technology market has experienced significant fluctuations in recent years, marked by production cuts and shifting prices. The beginning of 2024 saw a gradual recovery, driven by rising ...

Leading memory module manufacturers are looking to expand their supply to PC OEM customers to offload low-cost inventory, according to industry sources. With memory chip prices showing signs of ...

Advanced packaging technologies, such as 2.5D and 3D integration, allow for the stacking of memory and logic chips. Stacking ...

referring to dynamic random access memory (DRAM) chips that are widely used in computers and smartphones. "That is, the conventional DRAM supply glut will likely hurt Samsung far more than SK Hynix." ...

Today's computing systems rely on a combination of fast DRAM for active processing and flash storage for long-term data ...

In terms of the differences in packaging method, InFo allows integration of components, including memory ... Chip Module" part). This method allows more complex systems, such as CPUs, GPUs, DRAM ...

For example, a lower end graphics card with four 24Gb GDDR7 modules would ... A card with 16 memory chips works out to 48GB. "We will continue to lead the graphics DRAM market by bringing next ...

Samsung Electronics' (SSNLF) said it plans to focus on producing high-end chips and was making progress on an supply deal ...