As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity ... to high-bandwidth memory (HBM). However, based on the ...

More than 70% of TSMC’s CoWoS-L advanced packaging capacity has already been booked, fueled by strong demand for Nvidia’s ...

We already know the Instinct MI355X GPU is built on AMD's new ... access to high-bandwidth memory (HBM) and advanced packaging technologies like CoWoS, which have constrained its ability to ...

NVIDIA expected to unveil its beefed-up B300 AI GPUs at GTC 2025 in March, also talk about CPO technology-based InfiniBand ...

Korean media reports that TikTok parent company ByteDance has had its deal with Broadcom canceled, new 5nm AI accelerator deal could be finished.

The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking ... as ...

But probably not in 2025. As we have been saying, Nvidia has access to more HBM memory from Samsung, SK Hynix, and Micron Technology and more CoWoS interposer technology for lashing it to GPU chips ...

The chip is being produced using TSMC’s advanced 3-nanometer process and will feature a commonly used systolic array architecture, HBM, and advanced networking capabilities. OpenAI and TSMC ...

According to estimates by SemiAnalysis, Nvidia’s B200, which will feature 192 GB of high-bandwidth memory (HBM), will begin shipping ... This design will use the same GPU die that is being ...

the GPU will come with 192GB of HBM3 and a 5.2 TB/s memory bandwidth, which would put it well above the H200 in capacity and bandwidth. Intel, too, plans to ramp up the HBM capacity of its Gaudi ...

South Korea’s SK Hynix is currently considered the market leader in HBM. Yet Nvidia CEO Jensen Huang revealed at CES that a recently released Nvidia GPU, the RTX 50, uses Micron’s HBMs.