Choices include: Ball-grid array (BGA), land-grid array (LGA), pin grid array (PGA), and interstitial package grid array (IPGA) Single in-line package (SIP), dual in-line package (DIP ... sockets ...
Pin Receptacles ... of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs. DIP Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can ...
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